tungsten copper alloy

Short Description:

Tungsten-copper alloy combines the advantages of metallic tungsten and copper, among which tungsten has a high melting point(tungsten melting point is 3410 ℃, cooper melting point 1083 ℃),high density(The density of tungsten was 19.34g/cm3 and that of copper was 8.9 g/cm3),copper has excellent thermal conductivity, tungsten copper alloy, high temperature resistance, high strength, resistance to arc ablation, high density, moderate electrical and thermal conductivity, widely used in military high temperature resistant materials, high voltage switching alloys, electrical processing electrodes, microelectronic materials, as parts and components widely used in aerospace…


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    Product Tags

    Tungsten  Copper  Alloy

    Tungsten-copper alloy combines the advantages of metallic tungsten and copper, among which tungsten has a high melting point(tungsten melting point is 3410 ℃, cooper melting point 1083 ℃),high density(The density of tungsten was 19.34g/cm3 and that of copper was 8.9 g/cm3),copper has excellent thermal conductivity, tungsten copper alloy, high temperature resistance, high strength, resistance to arc ablation, high density, moderate electrical and thermal conductivity, widely used in military high temperature resistant materials, high voltage switching alloys, electrical processing electrodes, microelectronic materials, as parts and components widely used in aerospace, aviation, electronics, power, metallurgy, machinery, sports equipment and other industries.

    Military high temperature resistant materials

    Tungsten copper alloy used in aerospace missile and rocket engine nozzle, gas rudder, air rudder, the nose cone and main demands are resistant to high temperature (3000 k to 3000 k), high temperature resistant air scour capability, the main use of copper volatilization forming at high temperature of diaphoresis cooling (copper melting point 1083 ℃), decrease the temperature of tungsten copper surface, guarantee to be used in extreme conditions of high temperature.

    High voltage switch electrical alloy

    Tungsten copper alloy is used in 128kV SF6 circuit breaker WCu/CuCr,And high pressure vacuum load switch (12kV 40.5KV 1000A), environment.The main performance requirements are resistance to arc ablation, welding resistance, small cutoff current, less gas content, low thermal electron emission capacity. In addition to the conventional macroscopic performances, the porosity and microstructure performances are also required. Therefore, special processes, such as vacuum degassing and vacuum infiltration, are required.

    Electroworking electrode

    In the early days, copper or graphite electrodes were used for edm, which were cheap but not ablative.The advantages of tungsten copper electrode are high temperature resistance, high temperature strength, resistance to arc ablation, and good thermal conductivity, fast heat dissipation. Applications are concentrated on spark electrodes, resistance welding electrodes and high voltage discharge tube electrodes.Electroworking electrode is characterized by wide variety, small batch and large amount.Tungsten and copper materials as electroforming electrodes should have the highest possible density and homogeneity of microstructure, especially slender rod, tube and shaped electrodes.

    microelectronic material

    Tungsten-copper electronic packaging and heat-sink materials have both low expansion characteristics of tungsten and high thermal conductivity of copper, and their thermal expansion coefficient and thermal conductivity can be changed by adjusting the composition of tungsten-copper, thus providing a wider range of applications for tungsten-copper. Tungsten-copper materials are widely used in semiconductor materials because of their high heat resistance, good thermal conductivity, and thermal expansion coefficient matching with silicon wafers, gallium arsenide and ceramic materials..Suitable for high power device packaging materials, heat sink materials, heat sink components, ceramics and gallium arsenide base.


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